HORIBA Scientific has released the XGT-9000 X-ray analytical microscope (μXRF), which simultaneously performs elemental analysis and optical observation of samples. Incorporating HORIBA’s proprietary X-ray technology, the XGT-9000 not only screens foreign objects in a range of production processes, including semiconductor integrated circuits, it also measures film thickness and adherence amounts with a high degree of accuracy. By integrating the features of a high-resolution microscope and high-intensity X-ray beams, the XGT-9000 performs non-destructive foreign-object analysis on samples, switching between high-speed analysis mode for rapid screening of foreign objects, and detailed analysis mode using the micro beams first incorporated in earlier models. The XGT-9000 is equipped with three types of optical illuminations: bright field coaxial, dark field and transmission. Combining bright field coaxial and dark field illuminations enables clear observation of the samples with flat or uneven areas, such as semiconductor wafers and films. The XGT-9000 offers highly accurate and fast foreign-object analysis, enabling it to detect both visible foreign objects and invisible ones down to several microns in size.
Irradiating X-rays are coaxial with optical observation images, which avoids any misalignment. Other improvements include shortened analysis time, enhanced mapping and image processing, as well as ease of combination with other analysis equipment. The software package includes quantitative and qualitative chemical analyses, thickness determination and image analysis features.
